BONDPLAS ENGINEERING
With a focus on engineering design and consultancy activities n.e.c. activities, BONDPLAS ENGINEERING is a Singapore partnership (UEN: 53008004D), operating since Nov 13, 2003 and serving clients from its base at 20 WOODLANDS LINK #08, unit no. 016 Singapore 738733.
General Information
General information about BONDPLAS ENGINEERING
- Registered Name
- BONDPLAS ENGINEERING
- Unique Entity Number (UEN)
- 53008004D
- Registration Date
- 13 Nov 2003 (22 years old)
- Legal Entity Type
- Partnership
- Primary Business Activity
- ENGINEERING DESIGN AND CONSULTANCY ACTIVITIES N.E.C.
- Jurisdiction
- Singapore
- Address
- 20 WOODLANDS LINK #08, unit no. 016 Singapore 738733
- Entity Status
- LIVE
- Issuance Agency
- ACRA
User Contributed Information
Information about BONDPLAS ENGINEERING provided by Companies House users
Companies House cannot confirm that user-submitted information is fully accurate. Please submit corrections if you find any inaccuracies.
Buy Company Report
Official company report of BONDPLAS ENGINEERING as provided by the Accounting and Corporate Regulatory Authority of Singapore.
Est. delivery: 15 minutes
Thank you for the information we will review and publish it soon.